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7.2
Module Breakout connectors
All of the pins from the 40 way and 50 way connectors, WITH THE EXCEPTION OF Vcc
are available on each of two rows of plated through holes on the long sides of the board.
These translate directly to the pin layout of the module receptacles, allowing access to all
of the module pins. Pin 1 is indicated by an ident on the silk screen.
The format of the holes allows the fitting of your choice of connectors, or they can be
used for directly soldering test wires to the board. Both are laid out on a standard 0.1”
(2.54mm) pitch.
7.3
PCM Interface
The Development board provides a dedicated audio interface for the Bluetooth modules. The pins
provide the developer with access to the module’s PCM lines as well as providing power to allow
additional audio hardware to be developed. EZURiO has developed a range of audio codec
interface boards that can be plugged directly onto this interface to support audio application
development.
7.4
Board configuration jumpers
Jumper
JP1
JP2
JP8
J10
Description
Breaks the supply to the module for current measurements
Selects external power supply for Siemens modules
Selects pin 9 power
Selects low power mode for RS-232 level shifter
8.
8.1
Other Features
Power Consumption Measurement
A removable jumper JP1 is provided to break the supply line directly to the modules, allowing the
current consumption to be measured. For normal operation JP1 must be fitted.
Note that this only measures the current consumption of the module, and not of the level shifter or
other peripheral circuitry.
8.1
USB Access
USB access can be provided to allow a direct USB connection to a Bluetooth HCI module. To do
this remove resistors R17 and R18 from the development kit and replace them with zero Ohm
links.
Note that if this is done and the unit is then connected to a USB host port, it will be powered from
that same port. Do not attempt to use any other power source for the development kit when
operating in this mode.
This is not relevant for modules with a UART interface.
9.
Warranty
EZURiO warrants that its products shall conform to EZURiO’s published specifications and
remain free from defects in materials and workmanship under normal, proper and
APN_06008_1v0 Wireless Development Kit Manual.doc
Page 6
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相关代理商/技术参数
BISM_CONNECTORS # 制造商:Laird Technologies Inc 功能描述:
BISMS02BI 功能描述:蓝牙/802.15.1 模块 BISM II - Bluetooth Surface Mount Mod RoHS:否 制造商:Murata Wireless Solutions 类:1 频带:2402 MHz to 2480 MHz 灵敏度:- 92 dBm 数据速率: 工作电源电压:2.2 V to 3.3 V 输出功率: 接口类型:PCM, UART 天线连接器类型:Chip 最大工作温度:+ 85 C 尺寸:17.5 mm x 16 mm x 2 mm
BISMS02BI # 制造商:Laird Technologies Inc 功能描述:
BISMS02BI-01 制造商:Laird Technologies Inc 功能描述:MODULE BLUETOOTH BISM2 INT ANT 制造商:Laird Technologies Inc 功能描述:BLUETOOTH MODULE SM 制造商:Laird Technologies Inc 功能描述:BLUETOOTH MODULE, BC04, CERAMIC ANT 制造商:Laird Technologies Inc 功能描述:BLUETOOTH MODULE, BC04, CERAMIC ANT; Supply Voltage Min:3.3V; Supply Voltage Max:7V; Signal Range Max:300m; Data Rate:300Kbps; Bluetooth Version:Bluetooth 2.0; Bluetooth Class:Class 1; Receive Sensitivity:-84dB; Operating Temperature;RoHS Compliant: Yes 制造商:Laird Technologies 功能描述:Bluetooth Class I 0.3Mbps 42-Pin SMD
BISMS02BI-01 # 制造商:Laird Technologies Inc 功能描述:
BISMS02BI-NA 功能描述:蓝牙/802.15.1 模块 BISM II - Bluetooth Surface Mount w/U.FL RoHS:否 制造商:Murata Wireless Solutions 类:1 频带:2402 MHz to 2480 MHz 灵敏度:- 92 dBm 数据速率: 工作电源电压:2.2 V to 3.3 V 输出功率: 接口类型:PCM, UART 天线连接器类型:Chip 最大工作温度:+ 85 C 尺寸:17.5 mm x 16 mm x 2 mm
BISMS02BI-NA # 制造商:Laird Technologies Inc 功能描述:
BISPC01BI 制造商:Laird Technologies Inc 功能描述:PC CARD MODULE